HP PA 12


HP PA 12 Material
No matter how complex your designs, polyamide is a great and versatile choice. The self-supporting powder needs no support structure, and works equally well for fully functional prototypes or end-use parts. The PA 12 material used by HP Multi Jet Fusion technology has a very fine grain, resulting in parts with higher density and lower porosity than parts produced with Laser Sintering. That feature also makes PA 12 for MJF the ideal choice when you need more detailed surface resolution or thinner walls than are possible with Laser Sintering. Think crisp textures, embossing and engraving, or labels.

General properties Test Method Value
Powder melting point (DSC) ASTM D3418 187° C
Particle size ASTM 03451 60 µm
Bulk density of powder ASTM D1895 0,425 g/cm3
Density of parts ASTM D792 1,01 g/cm3
Mechanical Properties Test Method Value
Tensile Strength (Max Load XY) ASTM D638 48 MPa
Tensile Strength (Max Load Z) ASTM D638 48 MPa
Tensile Modulus (XY) ASTM D638 1700 Mpa
Tensile Modulus (Z) ASTM D638 1800 Mpa
Elongation at Break (XY) ASTM D638 20%
Elongation at Break (Z) ASTM D638 15%
Flexural strength (XY) ASTM D790 65 MPa
Flexural strength (Z) ASTM D790 70 MPa
Flexural modulus (XY) ASTM D790 1730 MPa
Flexural modulus (Z) ASTM D790 1730 MPa
Izod impact notched (XY) ASTM D256 3.5 kJ/m2
Izod impact notched (Z) ASTM D256 3.5 kJ/m2
Thermal Properties Test Method Value
Heat Deflection Temperature (@ 0.45 MPa) ASTM D648 175° C
Heat Deflection Temperature (@ 1.82 MPa) ASTM D648 95° C
Certifications
USP Class I-VI and US FDA guidance for Intact Skin Surface Devices, RoHS,11 REACH, PAHs, UL 94, UL 746A , Statement of Composition for Toy Applications.